Market share of epoxy resin and its curing agent f

2022-09-26
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Market analysis of epoxy resin and its curing agent for strategic emerging industries

I. epoxy resin and curing agent

epoxy resin refers to compounds containing (two or more) epoxy groups. The most commonly used, the largest output and the most varieties of epoxy resin are bisphenol A epoxy resin (or common type and common type), and others are collectively referred to as special epoxy resin, The usual epoxy resin is generally made of phenols (bisphenol A, etc.) and other substances containing active hydrogen with epichlorohydrin (ECH) under the action of caustic soda (NaOH)

generally, epoxy resin cannot be used alone (except for some engineering plastics used as plasticizer and lightproof agent). Its various properties can only be brought into play after it reacts with a substance called curing agent containing active hydrogen atoms to form an insoluble and insoluble substance with various properties, which is called curing substance (Japan and Taiwan become hardeners, which lie flat on the machine base support with an arched frame). Curing agents include amines, anhydrides, phenolic resins, etc. amines and their modifiers are generally used in coatings, adhesives, civil engineering, etc. anhydrides are generally used as pouring materials (transformers, mutual inductors) and electronic components, and phenolic resins are generally used in Electronics: copper clad laminates and plastic sealing materials. Dicyandiamide (dicy) is most commonly used on copper clad laminates

II. Domestic development status

the output of epoxy resin increased year by year, from 100000 tons in 2000 to 630000 tons in 2009; The self-sufficiency rate increased, and the import volume fell from 260000 tons in 2005 to 235000 tons in 2009. Domestic epoxy resin is mainly used in coatings (47%), electronic and electrical (42%), adhesives (11%)

III. primary epoxy resin (direct resin)

1. Liquid bisphenol A epoxy resin

liquid bisphenol A epoxy resin is called the grain of epoxy resin, and it can be processed into a variety of products with special properties (secondary processing products or composite type), which are mainly used in electronic and electrical (copper clad laminates, potting materials, castables), wind power resin (some use bisphenol F epoxy resin), composite materials Paint and adhesive (including solid bisphenol A)

2. Linear phenolic epoxy resin

is characterized by high heat resistance, high toughness, low viscosity and strong toughness. It is mainly used for copper clad laminates (mainly halogen-free, phosphorus containing epoxy resin copper clad laminates) and composites. With the current formula technology, it takes about 0.5 tons of phenolic epoxy resin and bisphenol F epoxy resin to produce 1 ton of phosphorus containing epoxy resin. With the halogen-free process of copper clad laminates (halogen-free is an inevitable trend in the electronic industry, especially in the consumer electronics industry), the demand will increase greatly, and the supply may exceed the demand. The main producers include Tokushima, Dow and South Asia (Taiwan)

3. Bisphenol F epoxy resin

is characterized by low viscosity, high flame retardancy and strong toughness. It is mainly used in solvent-free coatings, asphalt epoxy resins, wind power resins, halogen-free copper clad laminates and composites. The main manufacturers include Tokushima, South Asia (Taiwan), Dow, Hansen, etc

4. O-methyl phenolic epoxy resin

is characterized by high heat resistance, high strength, high purity, water resistance, insulation, multiple varieties and complex manufacturing technology. It is mainly used for plastic packaging materials (80% in China and 45% in Japan), copper clad laminates, PCB inks, composite materials and heavy corrosion prevention. The main producers include Tokushima chemical of Japan, Changchun of Taiwan, Yuehua and Jianghuan chemical. The future market demand is about 3 10000 tons/year

5. Crystalline epoxy resin

is characterized by very low melt viscosity, very good fluidity in the molten state, and high filling (up to 92% of silicon powder can be filled, so as to greatly reduce water absorption, linear expansion coefficient, reduce stress, improve reliability, at the same time, it is also possible to reduce costs. When the filler reaches 90%, flame retardants can also be achieved without using flame retardants), It is mainly used for plastic packaging materials (electronic components of computers and digital cameras. About 50% of the plastic packaging materials in the Japanese market are changed from o-methyl phenolic resin to crystalline epoxy resin, and 100% of the IC packaging uses crystalline epoxy resin), powder coating (10% of the resin is added to make the coating very smooth (mirror coating), flat, "said Dr. Mesut Cetin, product manager of Klaus mafi automation group (household appliances, computers, etc.), The durability, optical rotation resistance and yellowing resistance (refrigerators, microwave ovens, steel furniture, etc.) have been improved. There are resin varieties. The annual demand in the future is about 3000 tons

the manufacturers include Tokushima and Jer (two Japanese companies are monopolized, and neither China, South Korea, nor Taiwan). At present, the annual consumption of the domestic market is about tons. The main reasons for the failure to develop rapidly are high prices (the profit margin is more than 200%), the supply is not guaranteed (Japanese enterprises' technology blockade, giving priority to Japanese customers), and the production is not localized (the root cause). On the premise that the technology can be solved and the crystalline epoxy resin can be localized, assuming that 30% of the sealing materials of plastic (1) universal material testing machine use crystalline epoxy resin in 2015, the market demand in 2015 is tons

6. Bisphenol a phenolic epoxy resin is characterized by high heat resistance, strong toughness, low water absorption, relatively low cost and complex manufacturing technology. Copper clad laminate (improve the heat resistance and strength and toughness of lead-free plate, generally add 15 ~ 25%), with the increase of lead-free needs, the demand for this resin will increase greatly, and the market demand is about 30000 tons. Huacheng, Dongdu, Japan, Jer, Changchun, Taiwan

7. UV absorbing 4-functional epoxy resin is characterized by high heat resistance, UV absorption, complex manufacturing technology and complex equipment. It is mainly used for copper clad laminates (copper clad laminates with UV absorption function, generally adding 3 ~ 5phr to the resin). The total demand is currently tons/year, with an annual growth rate of about 8%. Manufacturers include Tokushima, Dow, Hansen, and South Asia (Taiwan)

8. Hydrogenated bisphenol A epoxy resin

is characterized by ultra-low viscosity, UV resistance, transparency, neutron absorption and non toxicity. It is mainly used for castables (under development) of outdoor transformers, mutual inductors and other electrical machines, wind power resins, outdoor coatings, outer coatings of ships and warships, advanced LED (transparency), advanced (wood grain) furniture coatings (non-toxic and transparent), military and nuclear power (neutron absorption). The main manufacturers are Tokushima, Japan, etc. At present, the annual demand is hundreds of tons, and the forecast for 2015 is about 3000 tons

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